Soldering and Surface Mount Technology : Impact Factor & More
eISSN: 1758-6836pISSN: 0954-0911
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Key Metrics
CiteScore 
3.6
SJR
Q2Materials Science (all)
SNIP
0.8
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Topics Covered on Soldering and Surface Mount Technology
Soldering and Surface Mount Technology Journal Specifications
Indexed in the following public directories
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Scopus 
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SJR
| Overview | |
| Publisher | EMERALD GROUP PUBLISHING LTD |
| Language | English |
| Frequency | Quarterly |
| General Details | |
| Language | English |
| Frequency | Quarterly |
| Publication Start Year | 1981 |
| Publisher URL | Visit website |
| Website URL | Visit website |
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Recently Published Papers in Soldering and Surface Mount Technology
Corrosion and hardness properties of SAC305/Cu solder joint by microwave hybrid heating
- 9 Jun 2026
- Soldering & Surface Mount Technology
Nanocopper-based low-temperature interconnection technology: advances in material systems, sintering mechanisms and packaging applications
- 1 Jun 2026
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L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits
- 28 May 2026
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Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects
- 26 May 2026
- Soldering & Surface Mount Technology
Robust low-temperature soldering of Cu plates via a novel Ni@Cu10Ni alloy mesh reinforced SAC305 composite solder
- 5 May 2026
- Soldering & Surface Mount Technology
Comparative study of tensile creep behaviour of lead-free solder alloys and conventional Sn–Pb solder
- 28 Apr 2026
- Soldering & Surface Mount Technology
Corrosion and hardness properties of SAC305/Cu solder joint by microwave hybrid heating
- 9 Jun 2026
- Soldering & Surface Mount Technology
Nanocopper-based low-temperature interconnection technology: advances in material systems, sintering mechanisms and packaging applications
- 1 Jun 2026
- Soldering & Surface Mount Technology
L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits
- 28 May 2026
- Soldering & Surface Mount Technology
Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects
- 26 May 2026
- Soldering & Surface Mount Technology
Robust low-temperature soldering of Cu plates via a novel Ni@Cu10Ni alloy mesh reinforced SAC305 composite solder
- 5 May 2026
- Soldering & Surface Mount Technology
Comparative study of tensile creep behaviour of lead-free solder alloys and conventional Sn–Pb solder
- 28 Apr 2026
- Soldering & Surface Mount Technology
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