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Microelectronics Reliability : Impact Factor & More

eISSN: 1872-941XpISSN: 0026-2714

Key Metrics

CiteScore
3.5
Impact Factor
< 5
SJR
Q2Condensed Matter Physics
SNIP
0.85
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Microelectronics Reliability Journal Specifications

Indexed in the following public directories

  • Web of Science Web of Science
  • Inspec Inspec
Overview
Publisher PERGAMON-ELSEVIER SCIENCE LTD
Language English
Frequency Monthly
General Details
LanguageEnglish
FrequencyMonthly
Publication Start Year1962
Publisher URLVisit website
Website URLVisit website
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Recently Published Papers in Microelectronics Reliability

Optimizing the capacitor insulator to enhance the bias-stress characteristics of LTPS-TFTs for improving the reliability of low-temperature polycrystalline-silicon active matrix organic light-emitting diodes
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Advanced fluxes for low-temperature copper-aluminum microjoining: Mechanisms and design
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Ball grid array solder joints thermal profile prediction and recipe optimization with physics-informed neural network
  • 1 Jun 2026
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Investigation on the interfacial electrical breakdown failure behavior in through silicon vias
  • 1 Jun 2026
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Design of high failure current embedded dual direction SCR with segmented topology for high-voltage ESD protection
  • 1 Jun 2026
  • Microelectronics Reliability
Copula based SFP+ transceiver MTTF estimation method by using optical power and sensitivity
  • 1 Jun 2026
  • Microelectronics Reliability
Optimizing the capacitor insulator to enhance the bias-stress characteristics of LTPS-TFTs for improving the reliability of low-temperature polycrystalline-silicon active matrix organic light-emitting diodes
  • 1 Jul 2026
  • Microelectronics Reliability
Advanced fluxes for low-temperature copper-aluminum microjoining: Mechanisms and design
  • 1 Jul 2026
  • Microelectronics Reliability
Ball grid array solder joints thermal profile prediction and recipe optimization with physics-informed neural network
  • 1 Jun 2026
  • Microelectronics Reliability
Investigation on the interfacial electrical breakdown failure behavior in through silicon vias
  • 1 Jun 2026
  • Microelectronics Reliability
Design of high failure current embedded dual direction SCR with segmented topology for high-voltage ESD protection
  • 1 Jun 2026
  • Microelectronics Reliability
Copula based SFP+ transceiver MTTF estimation method by using optical power and sensitivity
  • 1 Jun 2026
  • Microelectronics Reliability

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