Optimizing the capacitor insulator to enhance the bias-stress characteristics of LTPS-TFTs for improving the reliability of low-temperature polycrystalline-silicon active matrix organic light-emitting diodes

A new online monitoring method to detect thermal resistance via turbo sampling of plateau voltage

Advanced semiconductor packaging design via artificial intelligence and machine learning: A review

Thermo–vibration coupled reliability methodology of BGA solder joints considering the preload effect of heat sink bolts

Copula based SFP+ transceiver MTTF estimation method by using optical power and sensitivity

Toward stable FeFET multi-level cell operations using novel weight freezing methodology with recovery cycling scheme for neuromorphic applications

Optimizing the capacitor insulator to enhance the bias-stress characteristics of LTPS-TFTs for improving the reliability of low-temperature polycrystalline-silicon active matrix organic light-emitting diodes

A new online monitoring method to detect thermal resistance via turbo sampling of plateau voltage

Advanced semiconductor packaging design via artificial intelligence and machine learning: A review

Thermo–vibration coupled reliability methodology of BGA solder joints considering the preload effect of heat sink bolts

Copula based SFP+ transceiver MTTF estimation method by using optical power and sensitivity

Toward stable FeFET multi-level cell operations using novel weight freezing methodology with recovery cycling scheme for neuromorphic applications