Microelectronics International : Impact Factor & More
eISSN: 1758-812XpISSN: 1356-5362
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Aims and Scope of Microelectronics International
Microelectronics International is a peer-reviewed scientific journal published quarterly by Emerald Group Publishing. The editor is John Atkinson. It covers research on miniaturized electronic devices, microcircuit engineering, semiconductor technology, and systems engineering. Publishing formats include original technical papers, research papers, case studies, reviews, and book reviews. The journal was established in 1982 as Hybrid Circuits (ISSN 0265-3028). Less
Key Metrics
CiteScore 
1.6
Impact Factor
< 5
SJR
Q3Condensed Matter Physics
SNIP
0.47
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Topics Covered on Microelectronics International
Microelectronics International Journal Specifications
Indexed in the following public directories
Web of Science 
Scopus 
Inspec 
SJR
| Overview | |
| Publisher | EMERALD GROUP PUBLISHING LTD |
| Language | English |
| Frequency | Tri-annual |
| General Details | |
| Language | English |
| Frequency | Tri-annual |
| Publication Start Year | 1975 |
| Publisher URL | Visit website |
| Website URL | Visit website |
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Recently Published Papers in Microelectronics International
Dual-mode virtual inertia and damping control scheme for cascaded H-bridge converter-based BESS with enhanced frequency support ability
- 22 Apr 2026
- Microelectronics International
Guest editorial: Advanced sensing and control techniques for safety enhancement of power electronics components and systems in renewable energy applications-Part 1
- 10 Apr 2026
- Microelectronics International
Silicon photonics packaging for AI datacenters: technical challenges, reliability requirements and future directions – a critical review
- 7 Apr 2026
- Microelectronics International
Review of aluminum nitride buffer layer for high electron mobility transistor applications: growth technique and substrate choice
- 7 Apr 2026
- Microelectronics International
Analysis of stress relaxation in gate pins of press-pack IGBT devices based on multiphysics coupling
- 31 Mar 2026
- Microelectronics International
Bi-objective optimization of power cycling stress and return loss in stacked BGA solder joints based on NSGA-II algorithm
- 24 Mar 2026
- Microelectronics International
Dual-mode virtual inertia and damping control scheme for cascaded H-bridge converter-based BESS with enhanced frequency support ability
- 22 Apr 2026
- Microelectronics International
Guest editorial: Advanced sensing and control techniques for safety enhancement of power electronics components and systems in renewable energy applications-Part 1
- 10 Apr 2026
- Microelectronics International
Silicon photonics packaging for AI datacenters: technical challenges, reliability requirements and future directions – a critical review
- 7 Apr 2026
- Microelectronics International
Review of aluminum nitride buffer layer for high electron mobility transistor applications: growth technique and substrate choice
- 7 Apr 2026
- Microelectronics International
Analysis of stress relaxation in gate pins of press-pack IGBT devices based on multiphysics coupling
- 31 Mar 2026
- Microelectronics International
Bi-objective optimization of power cycling stress and return loss in stacked BGA solder joints based on NSGA-II algorithm
- 24 Mar 2026
- Microelectronics International
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