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Journal of Microelectronics and Electronic Packaging : Impact Factor & More

eISSN: 1555-8037pISSN: 1551-4897

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Journal of Microelectronics and Electronic Packaging Key Metrics

CiteScore
1.2
H-Index
18
SJR
Q4Computer Networks and Communications
SNIP
0.33

Topics Covered on Journal of Microelectronics and Electronic Packaging

Printed circuit board
Mold
Integrated circuit packaging
Redistribution layer
Co-fired ceramic
Sample preparation

Journal of Microelectronics and Electronic Packaging Journal Specifications

Overview
Publisher International Microelectronics And Packaging Society

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FAQs on Journal of Microelectronics and Electronic Packaging

How many articles did Journal of Microelectronics and Electronic Packaging publish last year? Faqs

In 2023, Journal of Microelectronics and Electronic Packaging publsihed 15 articles.

What is the eISSN & pISSN for Journal of Microelectronics and Electronic Packaging? Faqs

For Journal of Microelectronics and Electronic Packaging, eISSN is 1555-8037 and pISSN is 1551-4897.

What is Citescore for Journal of Microelectronics and Electronic Packaging? Faqs

Citescore for Journal of Microelectronics and Electronic Packaging is 1.2.

What is the H Index for Journal of Microelectronics and Electronic Packaging ? Faqs

H Index for Journal of Microelectronics and Electronic Packaging is 18.

What is SNIP score for Journal of Microelectronics and Electronic Packaging? Faqs

SNIP score for Journal of Microelectronics and Electronic Packaging is 0.33.

What is the SJR for Journal of Microelectronics and Electronic Packaging? Faqs

SJR for Journal of Microelectronics and Electronic Packaging is Q4.

Who is the publisher of Journal of Microelectronics and Electronic Packaging? Faqs

International Microelectronics And Packaging Society is the publisher of Journal of Microelectronics and Electronic Packaging.

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