Journal of Microelectronics and Electronic Packaging : Impact Factor & More
eISSN: 1555-8037pISSN: 1551-4897
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Key Metrics
CiteScore 
1.2
H-Index
18
SJR
Q4Computer Networks and Communications
SNIP
0.33
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Topics Covered on Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging Journal Specifications
| Overview | |
| Publisher | International Microelectronics And Packaging Society |
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Recently Published Papers in Journal of Microelectronics and Electronic Packaging
Enhancing Cu-Cu Stitch Bonding Reliability on Cu Leadframe Through Ultrathin Cu-Selective Passivation
- 15 Mar 2026
- Journal of Microelectronics and Electronic Packaging
Scalable Manufacturing of Multi-Stacked Copper Spiral Inductors Using a Novel Fully Additive Method
- 15 Mar 2026
- Journal of Microelectronics and Electronic Packaging
Engineering a Tunable Cu-Selective Oxide-Suppressing Coating to Enable Reliable Cu-to-Cu Direct Bonding for Advanced Interconnects
- 15 Mar 2026
- Journal of Microelectronics and Electronic Packaging
Advanced Modeling of Cure Shrinkage and Viscoelasticity for Warpage Prediction on Image Sensor Packaging
- 15 Mar 2026
- Journal of Microelectronics and Electronic Packaging
Jet Dispensing of Liquid Metal as a Thermal Interface Material
- 15 Dec 2025
- Journal of Microelectronics and Electronic Packaging
Co-Packaged Optics - Heterogeneous Integration of Chiplets (Switch, Photonic IC, and Electronic IC)
- 15 Dec 2025
- Journal of Microelectronics and Electronic Packaging
Enhancing Cu-Cu Stitch Bonding Reliability on Cu Leadframe Through Ultrathin Cu-Selective Passivation
- 15 Mar 2026
- Journal of Microelectronics and Electronic Packaging
Scalable Manufacturing of Multi-Stacked Copper Spiral Inductors Using a Novel Fully Additive Method
- 15 Mar 2026
- Journal of Microelectronics and Electronic Packaging
Engineering a Tunable Cu-Selective Oxide-Suppressing Coating to Enable Reliable Cu-to-Cu Direct Bonding for Advanced Interconnects
- 15 Mar 2026
- Journal of Microelectronics and Electronic Packaging
Advanced Modeling of Cure Shrinkage and Viscoelasticity for Warpage Prediction on Image Sensor Packaging
- 15 Mar 2026
- Journal of Microelectronics and Electronic Packaging
Jet Dispensing of Liquid Metal as a Thermal Interface Material
- 15 Dec 2025
- Journal of Microelectronics and Electronic Packaging
Co-Packaged Optics - Heterogeneous Integration of Chiplets (Switch, Photonic IC, and Electronic IC)
- 15 Dec 2025
- Journal of Microelectronics and Electronic Packaging
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