Journal of Microelectronics and Electronic Packaging : Impact Factor & More
eISSN: 1555-8037pISSN: 1551-4897
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Key Metrics
CiteScore 
1.2
H-Index
18
SJR
Q4Computer Networks and Communications
SNIP
0.33
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Topics Covered on Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging Journal Specifications
| Overview | |
| Publisher | International Microelectronics And Packaging Society |
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Recently Published Papers in Journal of Microelectronics and Electronic Packaging
Evaluating MEMS Switch Lifetime at Cryogenic Temperatures
- 15 Sep 2026
- Journal of Microelectronics and Electronic Packaging
Glass Packaging for Chiplets Heterogeneous Integration
- 15 Sep 2026
- Journal of Microelectronics and Electronic Packaging
Cu-Cu Hybrid Bonding for Chiplets Heterogeneous Integration
- 15 Sep 2026
- Journal of Microelectronics and Electronic Packaging
Jet-Dispensing Process Development for a Microparticle-Based Ag Sintering Paste for Pressureless Sintering of Miniaturized Opto-Electronic Components
- 15 Jun 2026
- Journal of Microelectronics and Electronic Packaging
Laser Cleaning Cylindrical Cells for Optimum Wire Bondability
- 15 Jun 2026
- Journal of Microelectronics and Electronic Packaging
Engineering a Tunable Cu-Selective Oxide-Suppressing Coating to Enable Reliable Cu-to-Cu Direct Bonding for Advanced Interconnects
- 15 Mar 2026
- Journal of Microelectronics and Electronic Packaging
Evaluating MEMS Switch Lifetime at Cryogenic Temperatures
- 15 Sep 2026
- Journal of Microelectronics and Electronic Packaging
Glass Packaging for Chiplets Heterogeneous Integration
- 15 Sep 2026
- Journal of Microelectronics and Electronic Packaging
Cu-Cu Hybrid Bonding for Chiplets Heterogeneous Integration
- 15 Sep 2026
- Journal of Microelectronics and Electronic Packaging
Jet-Dispensing Process Development for a Microparticle-Based Ag Sintering Paste for Pressureless Sintering of Miniaturized Opto-Electronic Components
- 15 Jun 2026
- Journal of Microelectronics and Electronic Packaging
Laser Cleaning Cylindrical Cells for Optimum Wire Bondability
- 15 Jun 2026
- Journal of Microelectronics and Electronic Packaging
Engineering a Tunable Cu-Selective Oxide-Suppressing Coating to Enable Reliable Cu-to-Cu Direct Bonding for Advanced Interconnects
- 15 Mar 2026
- Journal of Microelectronics and Electronic Packaging
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