Journal of Japan Institute of Electronics Packaging : Impact Factor & More
eISSN: 1884-121XpISSN: 1343-9677
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Key Metrics
CiteScore 
0.1
H-Index
11
SJR
Q4Electrical and Electronic Engineering
SNIP
0.06
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Journal of Japan Institute of Electronics Packaging Journal Specifications
| Overview | |
| Publisher | The Japan Institute of Electronics Packaging |
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Recently Published Papers in Journal of Japan Institute of Electronics Packaging
News
- 1 Mar 2026
- Journal of The Japan Institute of Electronics Packaging
Demonstration of Mode-Division-Multiplex-Transmission Using an Analog Front-End LSI
- 1 Mar 2026
- Journal of The Japan Institute of Electronics Packaging
Shiraishi Research Group, Nakazawa Laboratory, Electronics and Mechanical Science Division and Industry-Academia Collaboration Promotion Division, Graduate School of Science and Technology, Gunma University
- 1 Jan 2026
- Journal of The Japan Institute of Electronics Packaging
Materials and Equipment Technology Supporting Electronics Packaging
- 1 Jan 2026
- Journal of The Japan Institute of Electronics Packaging
Recent Progress and Prospect of Jisso Technology for Powerelectronics
- 1 Jan 2026
- Journal of The Japan Institute of Electronics Packaging
Research Trends of Thermal Management
- 1 Jan 2026
- Journal of The Japan Institute of Electronics Packaging
News
- 1 Mar 2026
- Journal of The Japan Institute of Electronics Packaging
Demonstration of Mode-Division-Multiplex-Transmission Using an Analog Front-End LSI
- 1 Mar 2026
- Journal of The Japan Institute of Electronics Packaging
Shiraishi Research Group, Nakazawa Laboratory, Electronics and Mechanical Science Division and Industry-Academia Collaboration Promotion Division, Graduate School of Science and Technology, Gunma University
- 1 Jan 2026
- Journal of The Japan Institute of Electronics Packaging
Materials and Equipment Technology Supporting Electronics Packaging
- 1 Jan 2026
- Journal of The Japan Institute of Electronics Packaging
Recent Progress and Prospect of Jisso Technology for Powerelectronics
- 1 Jan 2026
- Journal of The Japan Institute of Electronics Packaging
Research Trends of Thermal Management
- 1 Jan 2026
- Journal of The Japan Institute of Electronics Packaging
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