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Journal of Electronic Materials : Impact Factor & More

eISSN: 1543-186XpISSN: 0361-5235

Aims and Scope of Journal of Electronic Materials

The Journal of Electronic Materials is a monthly peer-reviewed scientific journal that publishes studies, research, developments, and applications of materials that produce electronics. The editor-in-chief is Shadi Shahedipour-Sandvik, SUNY Polytechnic Institute.The IEEE/TMS Journal of Electronic Materials (JEM) is jointly sponsored by the IEEE Electron Devices Society and The Minerals, Metals and Materials Society. It is published by Springer on behalf of IEEE and TMS. Less

Key Metrics

CiteScore
3.6
H-Index
107
Impact Factor
< 5
SJR
Q3Materials Chemistry
SNIP
0.6
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Topics Covered on Journal of Electronic Materials

Journal of Electronic Materials Journal Specifications

Overview
Publisher SPRINGER
Language English
Frequency Monthly
General Details
LanguageEnglish
FrequencyMonthly
Publication Start Year1972
Publisher URLVisit website
Website URLVisit website
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Recently Published Papers in Journal of Electronic Materials

Magnetically Aligned Carbon Fiber Networks: Enabling Silicone-Based Thermal Interface Materials with Enhanced Thermal Conductivity and Superhydrophobicity
  • 1 Jul 2026
  • Journal of Electronic Materials
High-Efficiency Ecofriendly Lead-Free Solar Cells Based on Rb2Sn(Br1−uIu)6 Double Perovskites Incorporating Cu2O as a Hole-Transport Layer: An Ab Initio DFT Study
  • 21 Jun 2026
  • Journal of Electronic Materials
Synergistic Role of Copper-Doped Barium Titanate and Functionalized Carbon Nanotubes in PVDF-HFP Nanofiber Films for Flexible Piezoelectric Energy Harvesting
  • 14 Jun 2026
  • Journal of Electronic Materials
High-Reliability Cu-Cu3Sn Composite Bonding for Power Electronics in Harsh Environments
  • 7 Jun 2026
  • Journal of Electronic Materials
Facile Synthesis of Ce-Doped ZnO@Chitosan Hybrid for Enhanced Visible-Light Degradation of Antibiotics and Antibacterial Applications
  • 2 Jun 2026
  • Journal of Electronic Materials
Electrochemical Copolymerization of Some Pyrimidine-N-Glycosides-Doped Poly(3,4-Ethylenedioxythiophene)/Polypyrrole Electrodes for Enhanced Supercapacitor Performance
  • 2 Jun 2026
  • Journal of Electronic Materials
Magnetically Aligned Carbon Fiber Networks: Enabling Silicone-Based Thermal Interface Materials with Enhanced Thermal Conductivity and Superhydrophobicity
  • 1 Jul 2026
  • Journal of Electronic Materials
High-Efficiency Ecofriendly Lead-Free Solar Cells Based on Rb2Sn(Br1−uIu)6 Double Perovskites Incorporating Cu2O as a Hole-Transport Layer: An Ab Initio DFT Study
  • 21 Jun 2026
  • Journal of Electronic Materials
Synergistic Role of Copper-Doped Barium Titanate and Functionalized Carbon Nanotubes in PVDF-HFP Nanofiber Films for Flexible Piezoelectric Energy Harvesting
  • 14 Jun 2026
  • Journal of Electronic Materials
High-Reliability Cu-Cu3Sn Composite Bonding for Power Electronics in Harsh Environments
  • 7 Jun 2026
  • Journal of Electronic Materials
Facile Synthesis of Ce-Doped ZnO@Chitosan Hybrid for Enhanced Visible-Light Degradation of Antibiotics and Antibacterial Applications
  • 2 Jun 2026
  • Journal of Electronic Materials
Electrochemical Copolymerization of Some Pyrimidine-N-Glycosides-Doped Poly(3,4-Ethylenedioxythiophene)/Polypyrrole Electrodes for Enhanced Supercapacitor Performance
  • 2 Jun 2026
  • Journal of Electronic Materials

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