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IEEE Transactions on Components, Packaging and Manufacturing Technology : Impact Factor & More

eISSN: 2156-3985pISSN: 2156-3950

Key Metrics

CiteScore
4.1
Impact Factor
< 5
SNIP
1.03
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IEEE Transactions on Components, Packaging and Manufacturing Technology Journal Specifications

Overview
Publisher IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Language English
Frequency Monthly
General Details
LanguageEnglish
FrequencyMonthly
Publication Start Year2011
Publisher URLVisit website
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Recently Published Papers in IEEE Transactions on Components, Packaging and Manufacturing Technology

TSV-Based Shoelace Inductor: A High-Density Solution for Advanced Packaging Platforms
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  • IEEE Transactions on Components, Packaging and Manufacturing Technology
A Perspective on the Formation of Tree-Like Copper Dendrites During Electrochemical Migration
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The Impact of Large-Amplitude Intermittent Current Pulsing on the Reliability of Die Metal–Dielectric Structures
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ThermoVision: Nondestructive Defect Mapping in 3-D Stacked Dies via Surface Thermography and Deep Learning
  • 1 Apr 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
Direct Bonding Technique for Integration and Vertical Interconnection of Metal-Air Coaxial Lines
  • 1 Apr 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
TSV-Based Shoelace Inductor: A High-Density Solution for Advanced Packaging Platforms
  • 1 Apr 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
A Perspective on the Formation of Tree-Like Copper Dendrites During Electrochemical Migration
  • 1 Apr 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
The Impact of Large-Amplitude Intermittent Current Pulsing on the Reliability of Die Metal–Dielectric Structures
  • 1 Apr 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
ThermoVision: Nondestructive Defect Mapping in 3-D Stacked Dies via Surface Thermography and Deep Learning
  • 1 Apr 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
Direct Bonding Technique for Integration and Vertical Interconnection of Metal-Air Coaxial Lines
  • 1 Apr 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology

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