IEEE Transactions on Components, Packaging and Manufacturing Technology : Impact Factor & More
eISSN: 2156-3985pISSN: 2156-3950
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Key Metrics
CiteScore 
4.1
Impact Factor
< 5
SNIP
1.03
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IEEE Transactions on Components, Packaging and Manufacturing Technology Journal Specifications
| Overview | |
| Publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
| Language | English |
| Frequency | Monthly |
| General Details |
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Recently Published Papers in IEEE Transactions on Components, Packaging and Manufacturing Technology
Improving Atomic Layer Deposition Process of Silicon Oxide (SiO <sub>2</sub> ) With Single and Double Pulse Processes
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D-Band Substrate Integrated Waveguide-Fed Endfire Antenna Array in Ultrathin Glass Interposer
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Efficient Tetrahedral SETD Implementations of Transient Electrothermal Cosimulation for Electronic Devices
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Foreword: Advanced Materials, Process Innovations, and Microelectronics Reliability
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A Perspective on the Formation of Tree-Like Copper Dendrites During Electrochemical Migration
- 1 Apr 2026
- IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
- 1 Apr 2026
- IEEE Transactions on Components, Packaging and Manufacturing Technology
Improving Atomic Layer Deposition Process of Silicon Oxide (SiO <sub>2</sub> ) With Single and Double Pulse Processes
- 1 Apr 2026
- IEEE Transactions on Components, Packaging and Manufacturing Technology
D-Band Substrate Integrated Waveguide-Fed Endfire Antenna Array in Ultrathin Glass Interposer
- 1 Apr 2026
- IEEE Transactions on Components, Packaging and Manufacturing Technology
Efficient Tetrahedral SETD Implementations of Transient Electrothermal Cosimulation for Electronic Devices
- 1 Apr 2026
- IEEE Transactions on Components, Packaging and Manufacturing Technology
Foreword: Advanced Materials, Process Innovations, and Microelectronics Reliability
- 1 Apr 2026
- IEEE Transactions on Components, Packaging and Manufacturing Technology
A Perspective on the Formation of Tree-Like Copper Dendrites During Electrochemical Migration
- 1 Apr 2026
- IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
- 1 Apr 2026
- IEEE Transactions on Components, Packaging and Manufacturing Technology
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