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Overview | |
Publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
Language | English |
Frequency | Monthly |
General Details |
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IEEE Transactions on Components, Packaging and Manufacturing Technology has been in operation since 2011 till date.
IEEE Transactions on Components, Packaging and Manufacturing Technology published with a Monthly frequency.
In 2023, IEEE Transactions on Components, Packaging and Manufacturing Technology publsihed undefined articles.
For IEEE Transactions on Components, Packaging and Manufacturing Technology, eISSN is 2156-3985 and pISSN is 2156-3950.
Citescore for IEEE Transactions on Components, Packaging and Manufacturing Technology is 4.1.
SNIP score for IEEE Transactions on Components, Packaging and Manufacturing Technology is 1.03.
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC is the publisher of IEEE Transactions on Components, Packaging and Manufacturing Technology.