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IEEE Microwave and Wireless Components Letters : Impact Factor & More
eISSN: 1558-1764pISSN: 1531-1309
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IEEE Microwave and Wireless Components Letters Key Metrics
CiteScore 
5
H-Index
112
Impact Factor
< 5
SNIP
1
Topics Covered on IEEE Microwave and Wireless Components Letters
Microstrip
Voltage-controlled oscillator
Amplitude
Balun
Design of experiments
RF power amplifier
Channel filter
Insertion loss
Monolayer
Wireless power transfer
Fractional bandwidth
Figure of merit
Bandwidth expansion
Center frequency
Broadband
Transmission zeros
Matched filter
Return loss
Causal model
Noise figure
IEEE Microwave and Wireless Components Letters Journal Specifications
Indexed in the following public directories
Scopus 
Web of Science
| Overview | |
| Publisher | IEEE |
| Language | English |
| Frequency | Monthly |
| General Details |
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Recently Published Papers in IEEE Microwave and Wireless Components Letters
Theory and Time-Domain Simulation of Third-Order Intermodulation Suppression by Signal Injection
- 1 Dec 2022
- IEEE Microwave and Wireless Components Letters
Effect of Different Shapes on the Measurement of Dielectric Constants of Low-Loss Materials With Rectangular Waveguides at <i>X</i>-Band
- 1 Dec 2022
- IEEE Microwave and Wireless Components Letters
Cylindrical Magnetically Coupled Resonant Wireless Power Transfer System Based on Flexible PCB Coils
- 1 Dec 2022
- IEEE Microwave and Wireless Components Letters
Accurate Magnetic Coupling Coefficient Modeling of 3-D Transformer Based on TSV
- 1 Dec 2022
- IEEE Microwave and Wireless Components Letters
Model-Based VF Technique for Parasitic Reflections Reduction of Frequency-Domain Chipless RFID Systems
- 1 Dec 2022
- IEEE Microwave and Wireless Components Letters
Microfluidically Reconfigurable mm-Wave Slow Wave Phase Shifter With Integrated Actuation
- 1 Dec 2022
- IEEE Microwave and Wireless Components Letters
Theory and Time-Domain Simulation of Third-Order Intermodulation Suppression by Signal Injection
- 1 Dec 2022
- IEEE Microwave and Wireless Components Letters
Effect of Different Shapes on the Measurement of Dielectric Constants of Low-Loss Materials With Rectangular Waveguides at <i>X</i>-Band
- 1 Dec 2022
- IEEE Microwave and Wireless Components Letters
Cylindrical Magnetically Coupled Resonant Wireless Power Transfer System Based on Flexible PCB Coils
- 1 Dec 2022
- IEEE Microwave and Wireless Components Letters
Accurate Magnetic Coupling Coefficient Modeling of 3-D Transformer Based on TSV
- 1 Dec 2022
- IEEE Microwave and Wireless Components Letters
Model-Based VF Technique for Parasitic Reflections Reduction of Frequency-Domain Chipless RFID Systems
- 1 Dec 2022
- IEEE Microwave and Wireless Components Letters
Microfluidically Reconfigurable mm-Wave Slow Wave Phase Shifter With Integrated Actuation
- 1 Dec 2022
- IEEE Microwave and Wireless Components Letters
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IEEE Microwave and Wireless Components Letters
Compare journals across 7 parameters SJR Ranking, Topics covered, Indexing Database, Publication Review Time, Publication Type, Article Processing Charges & Recently Published papers
SJR Ranking, Topics covered, Indexing Database, Publication Review Time, Publication Type, Article Processing Charges & Recently Published papers
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FAQs on IEEE Microwave and Wireless Components Letters
How long has IEEE Microwave and Wireless Components Letters been actively publishing? 
IEEE Microwave and Wireless Components Letters has been in operation since 1991 till date.
What is the publishing frequency of IEEE Microwave and Wireless Components Letters?
IEEE Microwave and Wireless Components Letters published with a Monthly frequency.
How many articles did IEEE Microwave and Wireless Components Letters publish last year?
In 2023, IEEE Microwave and Wireless Components Letters publsihed undefined articles.
What is the eISSN & pISSN for IEEE Microwave and Wireless Components Letters?
For IEEE Microwave and Wireless Components Letters, eISSN is 1558-1764 and pISSN is 1531-1309.
What is Citescore for IEEE Microwave and Wireless Components Letters?
Citescore for IEEE Microwave and Wireless Components Letters is 5.
What is the H Index for IEEE Microwave and Wireless Components Letters ?
H Index for IEEE Microwave and Wireless Components Letters is 112.
What is SNIP score for IEEE Microwave and Wireless Components Letters?
SNIP score for IEEE Microwave and Wireless Components Letters is 1.
Who is the publisher of IEEE Microwave and Wireless Components Letters?
IEEE is the publisher of IEEE Microwave and Wireless Components Letters.
