Key Metrics
1.2
CiteScore
CiteScore
CiteScore measures average citations received per document published in the serial.
18
H index
H-Index
Journal's h-index reflects the collective citation impact of the authors publishing in the journal. The h-index is defined as the maximum value of h such that the given journal has published at least h papers that have each been cited at least h times.
Q4
Computer Networks and Communications
SJR
- Q4 Computer Networks and Communications
- Q4 Electrical and Electronic Engineering
- Q4 Electronic, Optical and Magnetic Materials
SJR
SJR
SCImago Journal Rank measures weighted citations received by the serial. Citation weighting depends on subject field and prestige (SJR) of the citing serial.
0.33
SNIP
SNIP
Source Normalized Impact per Paper measures actual citations received relative to citations expected for the serial’s subject field.
Topics Covered on Journal of Microelectronics and Electronic Packaging
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Check my PaperRecently Published Papers
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Full paper
Enhancing Cu-Cu Stitch Bonding Reliability on Cu Leadframe Through Ultrathin Cu-Selective Passivation
- 15 Mar 26
- Journal of Microelectronics and Electronic Packaging
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Full paper
Scalable Manufacturing of Multi-Stacked Copper Spiral Inductors Using a Novel Fully Additive Method
- 15 Mar 26
- Journal of Microelectronics and Electronic Packaging
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Full paper
Engineering a Tunable Cu-Selective Oxide-Suppressing Coating to Enable Reliable Cu-to-Cu Direct Bonding for Advanced Interconnects
- 15 Mar 26
- Journal of Microelectronics and Electronic Packaging
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Full paper
Advanced Modeling of Cure Shrinkage and Viscoelasticity for Warpage Prediction on Image Sensor Packaging
- 15 Mar 26
- Journal of Microelectronics and Electronic Packaging
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Full paper
Jet Dispensing of Liquid Metal as a Thermal Interface Material
- 15 Dec 25
- Journal of Microelectronics and Electronic Packaging
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Full paper
Co-Packaged Optics - Heterogeneous Integration of Chiplets (Switch, Photonic IC, and Electronic IC)
- 15 Dec 25
- Journal of Microelectronics and Electronic Packaging
Scite analysis
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499 articles received 751 citations see all
- 19 Supporting
- 724 Mentioning
- 4 Contrasting
Editorial notices
- 0 Retractions
- 0 Withdrawals
- 0 Corrections
- 0 Errata
- 0 Expression of Concern
FAQs
How many articles did Journal of Microelectronics and Electronic Packaging publish last years ?
In 2025, Journal of Microelectronics and Electronic Packaging published 10 articles.
What is the eISSN & pISSN for Journal of Microelectronics and Electronic Packaging ?
For Journal of Microelectronics and Electronic Packaging,eISSN is 1555-8037 and pISSN is1551-4897.
What is Citescore for Journal of Microelectronics and Electronic Packaging ?
Citescore for Journal of Microelectronics and Electronic Packaging is 1.2.
What is H index for Journal of Microelectronics and Electronic Packaging ?
H index for Journal of Microelectronics and Electronic Packaging is 18.
What is SNIP score for Journal of Microelectronics and Electronic Packaging ?
SNIP score for Journal of Microelectronics and Electronic Packaging is 0.33.
What is the SJR for Journal of Microelectronics and Electronic Packaging ?
SJR for Journal of Microelectronics and Electronic Packaging is Q4.
Who is the publisher of Journal of Microelectronics and Electronic Packaging ?
International Microelectronics And Packaging Society is the publisher of Journal of Microelectronics and Electronic Packaging.