Key Metrics
1.2
CiteScore
CiteScore
CiteScore measures average citations received per document published in the serial.
18
H index
H-Index
Journal's h-index reflects the collective citation impact of the authors publishing in the journal. The h-index is defined as the maximum value of h such that the given journal has published at least h papers that have each been cited at least h times.
Q4
Computer Networks and Communications
SJR
- Q4 Computer Networks and Communications
- Q4 Electrical and Electronic Engineering
- Q4 Electronic, Optical and Magnetic Materials
SJR
SJR
SCImago Journal Rank measures weighted citations received by the serial. Citation weighting depends on subject field and prestige (SJR) of the citing serial.
0.33
SNIP
SNIP
Source Normalized Impact per Paper measures actual citations received relative to citations expected for the serial’s subject field.
Topics Covered
- Printed circuit board
- Mold
- Integrated circuit packaging
- Redistribution layer
- Co-fired ceramic
- Sample preparation
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Check my PaperRecently Published Papers
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Full paper
A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300°C
- 1 Jan 22
- Journal of Microelectronics and Electronic Packaging
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Full paper
Silver Sintering of Packaged GaN-Devices on Printed Circuit Board
- 1 Jan 22
- Journal of Microelectronics and Electronic Packaging
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Full paper
Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill
- 1 Jan 22
- Journal of Microelectronics and Electronic Packaging
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Full paper
Finite Element Modeling of Rigid-Flex PCBs for Dynamic Environments
- 1 Jan 22
- Journal of Microelectronics and Electronic Packaging
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Full paper
A New Approach for Assessing the Reliability of Electronic Assemblies Using Fuzzy Logic for Multi-criteria Optimization
- 1 Jan 22
- Journal of Microelectronics and Electronic Packaging
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Full paper
Designs for Reliability and Failure Mode Prevention of Electrical Feedthroughs in Integrated Downhole Logging Tools
- 1 Oct 21
- Journal of Microelectronics and Electronic Packaging
Scite analysis
Powered by scite_
493 articles received 692 citations see all
- 18 Supporting
- 668 Mentioning
- 2 Contrasting
Editorial notices
- 0 Retractions
- 0 Withdrawals
- 0 Corrections
- 0 Errata
- 0 Expression of Concern
FAQs
How many articles did Journal of Microelectronics and Electronic Packaging publish last years ?
In 2023, Journal of Microelectronics and Electronic Packaging published articles.
What is the eISSN & pISSN for Journal of Microelectronics and Electronic Packaging ?
For Journal of Microelectronics and Electronic Packaging,eISSN is 1555-8037 and pISSN is1551-4897.
What is Citescore for Journal of Microelectronics and Electronic Packaging ?
Citescore for Journal of Microelectronics and Electronic Packaging is 1.2.
What is H index for Journal of Microelectronics and Electronic Packaging ?
H index for Journal of Microelectronics and Electronic Packaging is 18.
What is SNIP score for Journal of Microelectronics and Electronic Packaging ?
SNIP score for Journal of Microelectronics and Electronic Packaging is 0.33.
What is the SJR for Journal of Microelectronics and Electronic Packaging ?
SJR for Journal of Microelectronics and Electronic Packaging is Q4.
Who is the publisher of Journal of Microelectronics and Electronic Packaging ?
International Microelectronics And Packaging Society is the publisher of Journal of Microelectronics and Electronic Packaging.