Key Metrics
1.2
CiteScore
CiteScore
CiteScore measures average citations received per document published in the serial.
18
H index
H-Index
Journal's h-index reflects the collective citation impact of the authors publishing in the journal. The h-index is defined as the maximum value of h such that the given journal has published at least h papers that have each been cited at least h times.
Q4
Computer Networks and Communications
SJR
- Q4 Computer Networks and Communications
- Q4 Electrical and Electronic Engineering
- Q4 Electronic, Optical and Magnetic Materials
SJR
SJR
SCImago Journal Rank measures weighted citations received by the serial. Citation weighting depends on subject field and prestige (SJR) of the citing serial.
0.33
SNIP
SNIP
Source Normalized Impact per Paper measures actual citations received relative to citations expected for the serial’s subject field.
Topics Covered
- Printed circuit board
- Mold
- Integrated circuit packaging
- Redistribution layer
- Co-fired ceramic
- Sample preparation
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Check my PaperRecently Published Papers
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Full paper
Design and Architecture Definition for Advanced 3D Fan-Out Wafer-Level Packaging
- 30 Sep 24
- Journal of Microelectronics and Electronic Packaging
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Full paper
Cold Sprayed Copper-Diamond Composites for Thermal Management of Semiconductor Packages
- 30 Sep 24
- Journal of Microelectronics and Electronic Packaging
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Full paper
Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire-Bonding Reliability
- 1 Apr 24
- Journal of Microelectronics and Electronic Packaging
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Full paper
Flip-Chip-Based Dual-Polarized Antenna-on-Package Arrays for 5G mmWave Modules
- 1 Apr 24
- Journal of Microelectronics and Electronic Packaging
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Full paper
Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding
- 1 Jan 24
- Journal of Microelectronics and Electronic Packaging
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Full paper
Reliability Assessment of Indium Micro Bumps for 2.5D/3D Electronic Packaging Through Cryo-Argon Milling Technique
- 1 Jan 24
- Journal of Microelectronics and Electronic Packaging
Scite analysis
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499 articles received 751 citations see all
- 19 Supporting
- 724 Mentioning
- 4 Contrasting
Editorial notices
- 0 Retractions
- 0 Withdrawals
- 0 Corrections
- 0 Errata
- 0 Expression of Concern
FAQs
How many articles did Journal of Microelectronics and Electronic Packaging publish last years ?
In 2023, Journal of Microelectronics and Electronic Packaging published 15 articles.
What is the eISSN & pISSN for Journal of Microelectronics and Electronic Packaging ?
For Journal of Microelectronics and Electronic Packaging,eISSN is 1555-8037 and pISSN is1551-4897.
What is Citescore for Journal of Microelectronics and Electronic Packaging ?
Citescore for Journal of Microelectronics and Electronic Packaging is 1.2.
What is H index for Journal of Microelectronics and Electronic Packaging ?
H index for Journal of Microelectronics and Electronic Packaging is 18.
What is SNIP score for Journal of Microelectronics and Electronic Packaging ?
SNIP score for Journal of Microelectronics and Electronic Packaging is 0.33.
What is the SJR for Journal of Microelectronics and Electronic Packaging ?
SJR for Journal of Microelectronics and Electronic Packaging is Q4.
Who is the publisher of Journal of Microelectronics and Electronic Packaging ?
International Microelectronics And Packaging Society is the publisher of Journal of Microelectronics and Electronic Packaging.