Soldering and Surface Mount Technology : Impact Factor & More
eISSN: 1758-6836pISSN: 0954-0911
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Key Metrics
CiteScore 
3.6
SJR
Q2Materials Science (all)
SNIP
0.8
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Topics Covered on Soldering and Surface Mount Technology
Soldering and Surface Mount Technology Journal Specifications
Indexed in the following public directories
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SJR
| Overview | |
| Publisher | EMERALD GROUP PUBLISHING LTD |
| Language | English |
| Frequency | Quarterly |
| General Details | |
| Language | English |
| Frequency | Quarterly |
| Publication Start Year | 1981 |
| Publisher URL | Visit website |
| Website URL | Visit website |
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Recently Published Papers in Soldering and Surface Mount Technology
Comparative study of tensile creep behaviour of lead-free solder alloys and conventional Sn–Pb solder
- 28 Apr 2026
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Experimental characterizations of the influence of sintering pressure on the high-temperature tensile behavior of sintered silver
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Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging
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Comparative analysis of the fatigue life of the FLASH under joint error conditions
- 9 Feb 2026
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Investigation on the effect of die-attaching on the mechanical properties and microstructure of nano-Cu sintered joints
- 3 Feb 2026
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Multi-parameter synergistic optimization and sintering densification of EHD-printed silver nanoparticle ink on alumina ceramic substrates
- 2 Feb 2026
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Comparative study of tensile creep behaviour of lead-free solder alloys and conventional Sn–Pb solder
- 28 Apr 2026
- Soldering & Surface Mount Technology
Experimental characterizations of the influence of sintering pressure on the high-temperature tensile behavior of sintered silver
- 27 Apr 2026
- Soldering & Surface Mount Technology
Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging
- 8 Apr 2026
- Soldering & Surface Mount Technology
Comparative analysis of the fatigue life of the FLASH under joint error conditions
- 9 Feb 2026
- Soldering & Surface Mount Technology
Investigation on the effect of die-attaching on the mechanical properties and microstructure of nano-Cu sintered joints
- 3 Feb 2026
- Soldering & Surface Mount Technology
Multi-parameter synergistic optimization and sintering densification of EHD-printed silver nanoparticle ink on alumina ceramic substrates
- 2 Feb 2026
- Soldering & Surface Mount Technology
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