Explore All Access
Check if your research matches the topics covered in Microelectronics International?
- Degree of match
- Common matching concepts
- Additional journal recommendations
Microelectronics International : Impact Factor & More
eISSN: 1758-812XpISSN: 1356-5362
Share this on:
Check your submission readiness
Find out how your manuscript stacks up against 24 technical compliance and 6 language quality checks.
Aims and Scope
Microelectronics International is a peer-reviewed scientific journal published quarterly by Emerald Group Publishing. The editor is John Atkinson. It covers research on miniaturized electronic devices, microcircuit engineering, semiconductor technology, and systems engineering. Publishing formats include original technical papers, research papers, case studies, reviews, and book reviews. The journal was established in 1982 as Hybrid Circuits (ISSN 0265-3028). Less
Microelectronics International Key Metrics
CiteScore 
1.6
Impact Factor
< 5
SJR
Q3Condensed Matter Physics
SNIP
0.47
Topics Covered on Microelectronics International
Microelectromechanical systems
Digital image correlation
Printed circuit board
Co-fired ceramic
Electronic packaging
Thermal reliability
Speckle pattern
Dielectrophoresis
Microelectronics International Journal Specifications
Indexed in the following public directories
Web of Science 
Scopus 
Inspec 
SJR
| Overview | |
| Publisher | EMERALD GROUP PUBLISHING LTD |
| Language | English |
| Frequency | Tri-annual |
| General Details | |
| Language | English |
| Frequency | Tri-annual |
| Publication Start Year | 1975 |
| Publisher URL | Visit website |
| Website URL | Visit website |
View less
Planning to publish in Microelectronics International ?
Upload your Manuscript to get
- Degree of match
- Common matching concepts
- Additional journal recommendations
Recently Published Papers in Microelectronics International
Study of the electronic transport performance of ZnO-SiO2 film: the construction of grain boundary barrier
- 9 Jul 2024
- Microelectronics International
3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process
- 31 May 2024
- Microelectronics International
Retraction notice: Packaging design and thermal analysis for 1 mm<sup>2</sup> high power VCSEL
- 22 Apr 2024
- Microelectronics International
Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents
- 15 Apr 2024
- Microelectronics International
Deformation and crack growth in multilayered ceramic capacitor during thermal reflow process: numerical and experimental investigation
- 15 Apr 2024
- Microelectronics International
Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications
- 5 Jan 2024
- Microelectronics International
Study of the electronic transport performance of ZnO-SiO2 film: the construction of grain boundary barrier
- 9 Jul 2024
- Microelectronics International
3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process
- 31 May 2024
- Microelectronics International
Retraction notice: Packaging design and thermal analysis for 1 mm<sup>2</sup> high power VCSEL
- 22 Apr 2024
- Microelectronics International
Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents
- 15 Apr 2024
- Microelectronics International
Deformation and crack growth in multilayered ceramic capacitor during thermal reflow process: numerical and experimental investigation
- 15 Apr 2024
- Microelectronics International
Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications
- 5 Jan 2024
- Microelectronics International
Compare Similar Journals with Microelectronics International
Select Journals to Compare with Microelectronics International
Total journals - 9
You can select up to 3 Journals at a time
Solar Energy
Publisher: PERGAMON-ELSEVIER SCIENCE LTD
ACS applied materials & interfaces
Publisher: AMER CHEMICAL SOC
Organic Electronics
Publisher: ELSEVIER
Journal of Materials Chemistry A
Publisher: ROYAL SOC CHEMISTRY
Solar Energy Materials and Solar Cells
Publisher: ELSEVIER
Journal of Materials Chemistry C
Publisher: ROYAL SOC CHEMISTRY
Materials
Publisher: MDPI
ACS Applied Energy Materials
Publisher: AMER CHEMICAL SOC
Thin Solid Films
Publisher: ELSEVIER SCIENCE SA
0 Journals Selected to compare with
Microelectronics International
Compare journals across 7 parameters SJR Ranking, Topics covered, Indexing Database, Publication Review Time, Publication Type, Article Processing Charges & Recently Published papers
SJR Ranking, Topics covered, Indexing Database, Publication Review Time, Publication Type, Article Processing Charges & Recently Published papers
Get detailed Journal comparison report on your email by signing up
FAQs on Microelectronics International
How long has Microelectronics International been actively publishing? 
Microelectronics International has been in operation since 1975 till date.
What is the publishing frequency of Microelectronics International?
Microelectronics International published with a Tri-annual frequency.
How many articles did Microelectronics International publish last year?
In 2023, Microelectronics International publsihed 33 articles.
What is the eISSN & pISSN for Microelectronics International?
For Microelectronics International, eISSN is 1758-812X and pISSN is 1356-5362.
What is Citescore for Microelectronics International?
Citescore for Microelectronics International is 1.6.
What is SNIP score for Microelectronics International?
SNIP score for Microelectronics International is 0.47.
What is the SJR for Microelectronics International?
SJR for Microelectronics International is Q3.
Who is the publisher of Microelectronics International?
EMERALD GROUP PUBLISHING LTD is the publisher of Microelectronics International.
