Key Metrics
CiteScore 

0.1
H-Index 

11
SJR 

Q4Electrical and Electronic Engineering

SNIP 

0.06
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Journal of Japan Institute of Electronics Packaging Journal Specifications
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| Publisher | The Japan Institute of Electronics Packaging |
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Recently Published Papers in Journal of Japan Institute of Electronics Packaging
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Green and Sustainable Semiconductor Manufacturing from the Point of View of Greenhouse Gas Emissions
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The Revised IEC Standards and Adaptation to the Latest Heat Dissipation Methods
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Thermal Management of Electronic Devices Using Lotus-Type Porous Copper: From Air Cooling to Two-Phase Immersion Cooling
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- Journal of The Japan Institute of Electronics Packaging
News
- 1 Sep 2025
- Journal of The Japan Institute of Electronics Packaging
Green and Sustainable Semiconductor Manufacturing from the Point of View of Greenhouse Gas Emissions
- 1 Sep 2025
- Journal of The Japan Institute of Electronics Packaging
Contents
- 1 Aug 2025
- Journal of The Japan Institute of Electronics Packaging
The Revised IEC Standards and Adaptation to the Latest Heat Dissipation Methods
- 1 Aug 2025
- Journal of The Japan Institute of Electronics Packaging
Instruction for Authors
- 1 Aug 2025
- Journal of The Japan Institute of Electronics Packaging
Thermal Management of Electronic Devices Using Lotus-Type Porous Copper: From Air Cooling to Two-Phase Immersion Cooling
- 1 Aug 2025
- Journal of The Japan Institute of Electronics Packaging