International Journal of Nanoelectronics and Materials : Impact Factor & More
eISSN: 2232-1535pISSN: 1985-5761
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Key Metrics
CiteScore 
1.6
H-Index
19
SJR
Q4Electrical and Electronic Engineering
SNIP
0.46
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International Journal of Nanoelectronics and Materials Journal Specifications
| Overview | |
| Publisher | UNIMAP PRESS |
| Language | English |
| Frequency | Semi-annual |
| General Details |
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Check my PaperRecently Published Papers in International Journal of Nanoelectronics and Materials
Exploring Electrospun Nanofiber Encapsulation as an Alternative to Cryopreservation for Semen Preservation
- 16 Jul 2026
- International Journal of Nanoelectronics and Materials (IJNeaM)
Investigation of Significant Parameter and Interaction of Plastic Transfer Molding Parameters for 3D Dual In-Line IC Package Encapsulation
- 16 Jul 2026
- International Journal of Nanoelectronics and Materials (IJNeaM)
Evaluate the impact of advanced cell pitch on U-MOSFET wafer edge IGSS failure in a CMOS environment
- 10 Apr 2026
- International Journal of Nanoelectronics and Materials (IJNeaM)
A recent review of recycled carbon fibre reinforced polymers: Recycling methods and their mechanical and electrical performance
- 10 Apr 2026
- International Journal of Nanoelectronics and Materials (IJNeaM)
Microplastic contamination in commercial goldfish (Carassius auratus) of Yuehai Lake via Laser Direct Infrared Imaging (LDIR)
- 9 Apr 2026
- International Journal of Nanoelectronics and Materials (IJNeaM)
Quantitative analysis of microplastic presence in commercially bottled drinking water brands and the associated human exposure
- 7 Apr 2026
- International Journal of Nanoelectronics and Materials (IJNeaM)
Exploring Electrospun Nanofiber Encapsulation as an Alternative to Cryopreservation for Semen Preservation
- 16 Jul 2026
- International Journal of Nanoelectronics and Materials (IJNeaM)
Investigation of Significant Parameter and Interaction of Plastic Transfer Molding Parameters for 3D Dual In-Line IC Package Encapsulation
- 16 Jul 2026
- International Journal of Nanoelectronics and Materials (IJNeaM)
Evaluate the impact of advanced cell pitch on U-MOSFET wafer edge IGSS failure in a CMOS environment
- 10 Apr 2026
- International Journal of Nanoelectronics and Materials (IJNeaM)
A recent review of recycled carbon fibre reinforced polymers: Recycling methods and their mechanical and electrical performance
- 10 Apr 2026
- International Journal of Nanoelectronics and Materials (IJNeaM)
Microplastic contamination in commercial goldfish (Carassius auratus) of Yuehai Lake via Laser Direct Infrared Imaging (LDIR)
- 9 Apr 2026
- International Journal of Nanoelectronics and Materials (IJNeaM)
Quantitative analysis of microplastic presence in commercially bottled drinking water brands and the associated human exposure
- 7 Apr 2026
- International Journal of Nanoelectronics and Materials (IJNeaM)
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