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Q4Electrical and Electronic Engineering

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Electronic Device Failure Analysis Journal Specifications
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| Publisher | ASM International |
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Check my PaperRecently Published Papers in Electronic Device Failure Analysis
Enhancing Soft Defect Localization with Software Automated Intelligent Laser Scanning (SAILS) and Array-Based Image Reconstruction
- 1 Feb 2026
- EDFA Technical Articles
Three Decades at ISTFA: A Journey of Learning and Networking
- 1 Feb 2026
- EDFA Technical Articles
A Step Toward Automation in Failure Analysis by FIB-SEM 3D Tomography and AI Segmentation
- 1 Feb 2026
- EDFA Technical Articles
Advanced Semiconductor Failure Analysis Using In-Situ AFM in FIB-SEM
- 1 Feb 2026
- EDFA Technical Articles
ISTFA 2025 Highlights
- 1 Feb 2026
- EDFA Technical Articles
Chiplet Architectures: Enabling Scalable Integration for the AI Era
- 1 Nov 2025
- EDFA Technical Articles
Enhancing Soft Defect Localization with Software Automated Intelligent Laser Scanning (SAILS) and Array-Based Image Reconstruction
- 1 Feb 2026
- EDFA Technical Articles
Three Decades at ISTFA: A Journey of Learning and Networking
- 1 Feb 2026
- EDFA Technical Articles
A Step Toward Automation in Failure Analysis by FIB-SEM 3D Tomography and AI Segmentation
- 1 Feb 2026
- EDFA Technical Articles
Advanced Semiconductor Failure Analysis Using In-Situ AFM in FIB-SEM
- 1 Feb 2026
- EDFA Technical Articles
ISTFA 2025 Highlights
- 1 Feb 2026
- EDFA Technical Articles
Chiplet Architectures: Enabling Scalable Integration for the AI Era
- 1 Nov 2025
- EDFA Technical Articles