Journal of Food Engineering : Impact Factor & More

eISSN: 1873-5770pISSN: 0260-8774

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Journal of Food Engineering Key Metrics

CiteScore
10.5
Eigenfactor
0.01 - 0.05
Impact Factor
5 - 10
SJR
Q1Food Science
SNIP
1.71
Time to Accept
4
 Mo
Time to Publish
time-to-publish View Chart
4
 Mo
Time to Publish

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% of papers by time taken from submission to publication
0 to 3 months
34%
4 to 6 months
55%
7 to 9 months
10%
Above 9 months
1%

Topics Covered on Journal of Food Engineering

Emulsion
Whey protein
Simulation
Digestion
Electric field
3D printing
Humidity
Curcumin
Particle size
Mathematical model
Pectin
Mass transfer
Starch
Soy protein
Extrusion
Chemical composition
Machine learning
Lactoferrin
Spray drying
Eggshell

Journal of Food Engineering Journal Specifications

Overview
Publisher ELSEVIER SCI LTD
Language Multi-Language
Frequency Semi-monthly
General Details
LanguageMulti-Language
FrequencySemi-monthly
Publication Start Year1982
Publisher URLVisit website
Website URLVisit website
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FAQs on Journal of Food Engineering

How long has Journal of Food Engineering been actively publishing? expand

Journal of Food Engineering has been in operation since 1982 till date.

What is the publishing frequency of Journal of Food Engineering? expand

Journal of Food Engineering published with a Semi-monthly frequency.

How many articles did Journal of Food Engineering publish last year? expand

In 2023, Journal of Food Engineering publsihed 399 articles.

What is the eISSN & pISSN for Journal of Food Engineering? expand

For Journal of Food Engineering, eISSN is 1873-5770 and pISSN is 0260-8774.

What is Citescore for Journal of Food Engineering? expand

Citescore for Journal of Food Engineering is 10.5.

What is SNIP score for Journal of Food Engineering? expand

SNIP score for Journal of Food Engineering is 1.71.

What is the SJR for Journal of Food Engineering? expand

SJR for Journal of Food Engineering is Q1.

Who is the publisher of Journal of Food Engineering? expand

ELSEVIER SCI LTD is the publisher of Journal of Food Engineering.