Journal of Electronic Packaging, Transactions of the ASME : Impact Factor & More
eISSN: 1528-9044pISSN: 1043-7398
Share this on:
Key Metrics
CiteScore 
3.7
Impact Factor
< 5
SJR
Q2Mechanics of Materials
SNIP
0.86
Recommended pre-submission checks
Powered by 
Run standard language and technical checks to improve your manuscript – before you submit
Technical Compliance
Ensure manuscript complies with standard submission guidelines.
Language Quality
Improve clarity, grammar, and academic writing style.
A comprehensive report covering all these checks awaits you.
Topics Covered on Journal of Electronic Packaging, Transactions of the ASME
Journal of Electronic Packaging, Transactions of the ASME Journal Specifications
| Overview | |
| Publisher | ASME |
| Language | English |
| Frequency | Quarterly |
| General Details | |
| Language | English |
| Frequency | Quarterly |
| Publication Start Year | 1989 |
| Publisher URL | Visit website |
| Website URL | Visit website |
View less
Planning to publish in Journal of Electronic Packaging, Transactions of the ASME ?
Upload your Manuscript to get
- Degree of match
- Common matching concepts
- Additional journal recommendations
Recently Published Papers in Journal of Electronic Packaging, Transactions of the ASME
Experimental Characterization of Geysering Instabilities in a Small-Scale Closed Loop Thermosyphon
- 4 Apr 2026
- Journal of Electronic Packaging
Effect Of Bending Deformation on Damage of Ag Nanoparticle Lines Under Electrical Loading
- 27 Mar 2026
- Journal of Electronic Packaging
Advances in the Reduction of the Warpage for Flip Chip Packages
- 27 Mar 2026
- Journal of Electronic Packaging
Thermodynamics, Diffusion and Activation Energy Of Sn-Cu Solder On Copper Substrates
- 5 Mar 2026
- Journal of Electronic Packaging
From Design of Experiments to Neural Network Models for Predicting Sintered Nano-Silver Joints Degradation Under Thermal Shocks
- 26 Feb 2026
- Journal of Electronic Packaging
Stencil-Assisted Electrospray Deposition of Silver Films on Insulators for EMI Shielding
- 26 Feb 2026
- Journal of Electronic Packaging
Experimental Characterization of Geysering Instabilities in a Small-Scale Closed Loop Thermosyphon
- 4 Apr 2026
- Journal of Electronic Packaging
Effect Of Bending Deformation on Damage of Ag Nanoparticle Lines Under Electrical Loading
- 27 Mar 2026
- Journal of Electronic Packaging
Advances in the Reduction of the Warpage for Flip Chip Packages
- 27 Mar 2026
- Journal of Electronic Packaging
Thermodynamics, Diffusion and Activation Energy Of Sn-Cu Solder On Copper Substrates
- 5 Mar 2026
- Journal of Electronic Packaging
From Design of Experiments to Neural Network Models for Predicting Sintered Nano-Silver Joints Degradation Under Thermal Shocks
- 26 Feb 2026
- Journal of Electronic Packaging
Stencil-Assisted Electrospray Deposition of Silver Films on Insulators for EMI Shielding
- 26 Feb 2026
- Journal of Electronic Packaging
FAQs on Journal of Electronic Packaging, Transactions of the ASME
How long has Journal of Electronic Packaging, Transactions of the ASME been actively publishing? 
What is the publishing frequency of Journal of Electronic Packaging, Transactions of the ASME?
How many articles did Journal of Electronic Packaging, Transactions of the ASME publish last year?
What is the eISSN & pISSN for Journal of Electronic Packaging, Transactions of the ASME?
What is Citescore for Journal of Electronic Packaging, Transactions of the ASME?
What is SNIP score for Journal of Electronic Packaging, Transactions of the ASME?
What is the SJR for Journal of Electronic Packaging, Transactions of the ASME?
Who is the publisher of Journal of Electronic Packaging, Transactions of the ASME?
