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Journal of Electronic Packaging, Transactions of the ASME : Impact Factor & More
eISSN: 1528-9044pISSN: 1043-7398
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Journal of Electronic Packaging, Transactions of the ASME Key Metrics
CiteScore 
3.7
Impact Factor
< 5
SJR
Q2Mechanics of Materials
SNIP
0.86
Topics Covered on Journal of Electronic Packaging, Transactions of the ASME
Heat transfer
Heat sink
Power electronics
Spray cooling
Electronic packaging
Carbon black
Chip stacking
Data center
Printed circuit board
Information technology
Thermal resistance
Heat flux
Architectural design
Heat transfer enhancement
Online advertising
Thermal solution
Cold plate
Simulation
Power module
Journal of Electronic Packaging, Transactions of the ASME Journal Specifications
| Overview | |
| Publisher | ASME |
| Language | English |
| Frequency | Quarterly |
| General Details | |
| Language | English |
| Frequency | Quarterly |
| Publication Start Year | 1989 |
| Publisher URL | Visit website |
| Website URL | Visit website |
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Recently Published Papers in Journal of Electronic Packaging, Transactions of the ASME
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
- 9 Dec 2024
- Journal of Electronic Packaging
Performance Analysis of a Brazed Plate Heat Exchanger during Condensation of R1233zd(E)
- 7 Dec 2024
- Journal of Electronic Packaging
Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
- 27 Nov 2024
- Journal of Electronic Packaging
Electrochemical Linked to Mechanical Simulation for an Assessment of State-Of-Health of Thin-flexible Li-ion Batteries on Dynamic Flexing and Calendar Aging
- 27 Nov 2024
- Journal of Electronic Packaging
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
- 20 Nov 2024
- Journal of Electronic Packaging
Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads
- 13 Nov 2024
- Journal of Electronic Packaging
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
- 9 Dec 2024
- Journal of Electronic Packaging
Performance Analysis of a Brazed Plate Heat Exchanger during Condensation of R1233zd(E)
- 7 Dec 2024
- Journal of Electronic Packaging
Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
- 27 Nov 2024
- Journal of Electronic Packaging
Electrochemical Linked to Mechanical Simulation for an Assessment of State-Of-Health of Thin-flexible Li-ion Batteries on Dynamic Flexing and Calendar Aging
- 27 Nov 2024
- Journal of Electronic Packaging
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
- 20 Nov 2024
- Journal of Electronic Packaging
Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads
- 13 Nov 2024
- Journal of Electronic Packaging
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Compare journals across 7 parameters SJR Ranking, Topics covered, Indexing Database, Publication Review Time, Publication Type, Article Processing Charges & Recently Published papers
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FAQs on Journal of Electronic Packaging, Transactions of the ASME
How long has Journal of Electronic Packaging, Transactions of the ASME been actively publishing? 
Journal of Electronic Packaging, Transactions of the ASME has been in operation since 1989 till date.
What is the publishing frequency of Journal of Electronic Packaging, Transactions of the ASME?
Journal of Electronic Packaging, Transactions of the ASME published with a Quarterly frequency.
How many articles did Journal of Electronic Packaging, Transactions of the ASME publish last year?
In 2023, Journal of Electronic Packaging, Transactions of the ASME publsihed 43 articles.
What is the eISSN & pISSN for Journal of Electronic Packaging, Transactions of the ASME?
For Journal of Electronic Packaging, Transactions of the ASME, eISSN is 1528-9044 and pISSN is 1043-7398.
What is Citescore for Journal of Electronic Packaging, Transactions of the ASME?
Citescore for Journal of Electronic Packaging, Transactions of the ASME is 3.7.
What is SNIP score for Journal of Electronic Packaging, Transactions of the ASME?
SNIP score for Journal of Electronic Packaging, Transactions of the ASME is 0.86.
What is the SJR for Journal of Electronic Packaging, Transactions of the ASME?
SJR for Journal of Electronic Packaging, Transactions of the ASME is Q2.
Who is the publisher of Journal of Electronic Packaging, Transactions of the ASME?
ASME is the publisher of Journal of Electronic Packaging, Transactions of the ASME.
