Nanoscale and Microscale Thermophysical Engineering

eISSN: 1556-7273 pISSN: 1556-7265

Key Metrics

5.8
CiteScore
< 5
Impact Factor
57
H index
Q2 Mechanics of Materials
SJR
0.78
SNIP

Topics Covered on Nanoscale and Microscale Thermophysical Engineering

Journal Specifications

Overview
Publisher TAYLOR & FRANCIS INC
Language English
Frequency Quarterly
General Details
Language English
Frequency Quarterly
Publication Start Year 2006
Publisher URL Visit website
Website URL Visit website

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Scite analysis

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343 articles received 3.8k citations see all

  • 119 Supporting
  • 3,668 Mentioning
  • 9 Contrasting

Editorial notices

  • 0 Retractions
  • 0 Withdrawals
  • 3 Corrections
  • 0 Errata
  • 0 Expression of Concern

FAQs

How long has Nanoscale and Microscale Thermophysical Engineering been actively publishing?

Nanoscale and Microscale Thermophysical Engineering has been in operation since 2006 till date.

What is the publishing frequency of Nanoscale and Microscale Thermophysical Engineering ?

Nanoscale and Microscale Thermophysical Engineering published with a Quarterly frequency.

What is the eISSN & pISSN for Nanoscale and Microscale Thermophysical Engineering ?

For Nanoscale and Microscale Thermophysical Engineering,eISSN is 1556-7273 and pISSN is1556-7265.

What is Citescore for Nanoscale and Microscale Thermophysical Engineering ?

Citescore for Nanoscale and Microscale Thermophysical Engineering is 5.8.

What is H index for Nanoscale and Microscale Thermophysical Engineering ?

H index for Nanoscale and Microscale Thermophysical Engineering is 57.

What is SNIP score for Nanoscale and Microscale Thermophysical Engineering ?

SNIP score for Nanoscale and Microscale Thermophysical Engineering is 0.78.

What is the SJR for Nanoscale and Microscale Thermophysical Engineering ?

SJR for Nanoscale and Microscale Thermophysical Engineering is Q2.

Who is the publisher of Nanoscale and Microscale Thermophysical Engineering ?

TAYLOR & FRANCIS INC is the publisher of Nanoscale and Microscale Thermophysical Engineering.