The Journal of Micromechanics and Microengineering is a peer-reviewed scientific journal that covers all aspects of microelectromechanical systems, devices and structures, as well as micromechanics, microengineering, and microfabrication. The editor-in-chief is Weileun Fang (National Tsing Hua University).
CiteScore measures average citations received per document published in the serial.
Impact factor of a journal is calculated by dividing the number of current year citations to the source items published in that journal during the previous two years.
SCImago Journal Rank measures weighted citations received by the serial. Citation weighting depends on subject field and prestige (SJR) of the citing serial.
Source Normalized Impact per Paper measures actual citations received relative to citations expected for the serial’s subject field.
Based on turnaround time from submission to publication for papers (articles & reviews) published in 2022 and for journals with a sample of more than 10 papers.
Based on turnaround time from submission to publication for papers (articles & reviews) published in 2022 and for journals with a sample of more than 10 papers.
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Overview | |
Publisher | IOP PUBLISHING LTD |
Language | English |
Frequency | Monthly |
General Details | |
Language | English |
Frequency | Monthly |
Publication Start Year | 1991 |
Publisher URL | Visit website |
Website URL | Visit website |
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Journal of Micromechanics and Microengineering has been in operation since 1991 till date.
Journal of Micromechanics and Microengineering published with a Monthly frequency.
In 2023, Journal of Micromechanics and Microengineering published 136 articles.
For Journal of Micromechanics and Microengineering,eISSN is 1361-6439 and pISSN is0960-1317.
Citescore for Journal of Micromechanics and Microengineering is 4.
SNIP score for Journal of Micromechanics and Microengineering is 0.76.
SJR for Journal of Micromechanics and Microengineering is Q2.
IOP PUBLISHING LTD is the publisher of Journal of Micromechanics and Microengineering.