Key Metrics
3.7
CiteScore
CiteScore
CiteScore measures average citations received per document published in the serial.
< 5
Impact Factor
Impact Factor
Impact factor of a journal is calculated by dividing the number of current year citations to the source items published in that journal during the previous two years.
Q2
Mechanics of Materials
SJR
- Q2 Mechanics of Materials
- Q2 Computer Science Applications
- Q2 Electrical and Electronic Engineering
- Q2 Electronic, Optical and Magnetic Materials
SJR
SJR
SCImago Journal Rank measures weighted citations received by the serial. Citation weighting depends on subject field and prestige (SJR) of the citing serial.
0.86
SNIP
SNIP
Source Normalized Impact per Paper measures actual citations received relative to citations expected for the serial’s subject field.
Topics Covered
- Heat transfer
- Heat sink
- Power electronics
- Spray cooling
- Electronic packaging
- Carbon black
- Chip stacking
- Data center
- Printed circuit board
- Information technology
- Thermal resistance
- Heat flux
- Architectural design
- Heat transfer enhancement
- Online advertising
- Thermal solution
- Cold plate
- Simulation
- Power module
Journal Specifications
| Overview | |
| Publisher | ASME |
| Language | English |
| Frequency | Quarterly |
| General Details | |
| Language | English |
| Frequency | Quarterly |
| Publication Start Year | 1989 |
| Publisher URL | Visit website |
| Website URL | Visit website |
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Check my PaperRecently Published Papers
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Behavior of Polymeric Substrates and Sintered Silver Printed Hybrid Electronic Assemblies Subject to Extreme Acceleration Levels and Elevated Temperatures
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Scite analysis
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2.2k articles received 13.8k citations see all
- 310 Supporting
- 13,318 Mentioning
- 20 Contrasting
Editorial notices
- 0 Retractions
- 0 Withdrawals
- 0 Corrections
- 11 Errata
- 0 Expression of Concern
FAQs
How long has Journal of Electronic Packaging, Transactions of the ASME been actively publishing?
Journal of Electronic Packaging, Transactions of the ASME has been in operation since 1989 till date.
What is the publishing frequency of Journal of Electronic Packaging, Transactions of the ASME ?
Journal of Electronic Packaging, Transactions of the ASME published with a Quarterly frequency.
How many articles did Journal of Electronic Packaging, Transactions of the ASME publish last years ?
In 2023, Journal of Electronic Packaging, Transactions of the ASME published 43 articles.
What is the eISSN & pISSN for Journal of Electronic Packaging, Transactions of the ASME ?
For Journal of Electronic Packaging, Transactions of the ASME,eISSN is 1528-9044 and pISSN is1043-7398.
What is Citescore for Journal of Electronic Packaging, Transactions of the ASME ?
Citescore for Journal of Electronic Packaging, Transactions of the ASME is 3.7.
What is SNIP score for Journal of Electronic Packaging, Transactions of the ASME ?
SNIP score for Journal of Electronic Packaging, Transactions of the ASME is 0.86.
What is the SJR for Journal of Electronic Packaging, Transactions of the ASME ?
SJR for Journal of Electronic Packaging, Transactions of the ASME is Q2.
Who is the publisher of Journal of Electronic Packaging, Transactions of the ASME ?
ASME is the publisher of Journal of Electronic Packaging, Transactions of the ASME.