IEEE Transactions on Components, Packaging and Manufacturing Technology
eISSN: 2156-3985
pISSN: 2156-3950
Key Metrics
4.1
CiteScore
CiteScore
CiteScore measures average citations received per document published in the serial.
< 5
Impact Factor
Impact Factor
Impact factor of a journal is calculated by dividing the number of current year citations to the source items published in that journal during the previous two years.
1.03
SNIP
SNIP
Source Normalized Impact per Paper measures actual citations received relative to citations expected for the serial’s subject field.
Journal Specifications
| Overview | |
| Publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
| Language | English |
| Frequency | Monthly |
| General Details | |
| Language | English |
| Frequency | Monthly |
| Publication Start Year | 2011 |
| Publisher URL | Visit website |
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Check my PaperRecently Published Papers
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Full paper
High-Selectivity Bandpass Filter-Integrated SPDT Switch Using Switchable Dual-Mode Hybrid Resonators
- 1 Oct 24
- IEEE Transactions on Components, Packaging and Manufacturing Technology
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Full paper
The Impact of Bonding Wire Failure in Microelectronic Package on Near-Field Radiation
- 1 Oct 24
- IEEE Transactions on Components, Packaging and Manufacturing Technology
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Full paper
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors
- 1 Oct 24
- IEEE Transactions on Components, Packaging and Manufacturing Technology
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Full paper
Table of Contents
- 1 Oct 24
- IEEE Transactions on Components, Packaging and Manufacturing Technology
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Full paper
Extremely Rare Anomaly Detection Pipeline in Semiconductor Bonding Process With Digital Twin-Driven Data Augmentation Method
- 1 Oct 24
- IEEE Transactions on Components, Packaging and Manufacturing Technology
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Full paper
Glass Package With Multiple Embedded Dies for mmWave Applications
- 1 Oct 24
- IEEE Transactions on Components, Packaging and Manufacturing Technology
Scite analysis
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4.4k articles received 15.8k citations see all
- 151 Supporting
- 15,520 Mentioning
- 20 Contrasting
Editorial notices
- 1 Retractions
- 0 Withdrawals
- 0 Corrections
- 0 Errata
- 0 Expression of Concern
FAQs
How long has IEEE Transactions on Components, Packaging and Manufacturing Technology been actively publishing?
IEEE Transactions on Components, Packaging and Manufacturing Technology has been in operation since 2011 till date.
What is the publishing frequency of IEEE Transactions on Components, Packaging and Manufacturing Technology ?
IEEE Transactions on Components, Packaging and Manufacturing Technology published with a Monthly frequency.
How many articles did IEEE Transactions on Components, Packaging and Manufacturing Technology publish last years ?
In 2023, IEEE Transactions on Components, Packaging and Manufacturing Technology published 305 articles.
What is the eISSN & pISSN for IEEE Transactions on Components, Packaging and Manufacturing Technology ?
For IEEE Transactions on Components, Packaging and Manufacturing Technology,eISSN is 2156-3985 and pISSN is2156-3950.
What is Citescore for IEEE Transactions on Components, Packaging and Manufacturing Technology ?
Citescore for IEEE Transactions on Components, Packaging and Manufacturing Technology is 4.1.
What is SNIP score for IEEE Transactions on Components, Packaging and Manufacturing Technology ?
SNIP score for IEEE Transactions on Components, Packaging and Manufacturing Technology is 1.03.
Who is the publisher of IEEE Transactions on Components, Packaging and Manufacturing Technology ?
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC is the publisher of IEEE Transactions on Components, Packaging and Manufacturing Technology.